| 摘要 |
Disclosed is a substrate processing device. A substrate processing device according to an embodiment of the present invention comprises: a plurality of pattern forming modules linearly arranged and having a laser beam irradiating unit for irradiating laser beams, a polygon scanner for reflecting the laser beams irradiated from the laser beam irradiating unit, and a controller for controlling the laser beam irradiating unit and the polygon scanner; and a signal synchronizing unit for synchronizing a signal between the pattern forming modules so as to process a substrate. Substrates may be simultaneously processed, so even large-size substrates may be easily processed in a short time and process precision of the large-size substrates may be improved. |
