| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin package for a surface mounting type light-emitting device and the surface mounting type light-emitting device consisting of a white thermosetting composition without inducing deterioration of a mold surface even in long term continuous molding.SOLUTION: There is provided a manufacturing method of a resin molded body for a surface mounting type light-emitting device consisting of a molded body 4 of a while thermosetting composition for mounting an optical semiconductor element, including a process for performing transfer molding and post curing of the white thermosetting composition to obtain a resin cured body having an optical reflectance at 460 nm of 80% or more, and using a mold subjected to surface coating treatment or surface plating treatment for the white thermosetting composition so that mold recoating is not required and the number of continuous molding is 10000 or more, and in which the white thermosetting composition contains (A) thermosetting organopolysiloxane, (B) a white pigment, (C) an inorganic filler and (D) a curing catalyst as essential components and a Mohs hardness of the (B) component is 6.5 or less.SELECTED DRAWING: Figure 4 |
