发明名称 PHOTOCURABLE ADHESIVE COMPOSITION AND OPTICAL SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a photocurable adhesive composition capable of achieving excellent application property and mounting property.SOLUTION: There is provided a photocurable adhesive composition containing [A] an epoxy resin and an aliphatic polyether skeleton epoxy resin having at least two glycidyl ether groups which bind to an aromatic ring directly, [B] an alicyclic epoxy compound, [C] an optical cation polymerization catalyst, [D] a silane coupling agent and [E] silica fine particle, where [C] is 0.1 to 10 pts.wt., [D] is 0.1 to 3 pts.wt., [E] is 150 to 300 pts.wt. based on 100 pts.wt. of the total amount of [A] and [B], [E] contains [E1] fine particle which is hydrophobic silica fine particle and has average particle diameter of primary aggregate particle thereof of 100 to 400 nm and [E2] fine particle which is hydrophilic silica fine particle and has average particle diameter of secondary aggregate particle of 0.5 to 5 μm and the content of [E1] is 0.1 to 5 wt.% based on the total weight of [E].SELECTED DRAWING: None
申请公布号 JP2016094509(A) 申请公布日期 2016.05.26
申请号 JP20140230023 申请日期 2014.11.12
申请人 SUMITOMO ELECTRIC IND LTD 发明人 TANAKA KAZUNORI
分类号 C09J163/00;C09J11/04;C09J11/06;H01L21/52;H01L33/58 主分类号 C09J163/00
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