ELECTRONIC COMPONENT DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide an electronic component device of a structure which is capable of connecting two electronic components with high reliability via wiring components.SOLUTION: An electronic component device comprises: a first insulation layer 31 on which a wiring component mounting region A is defined; a wiring layer P formed on the first insulation layer 31 except the wiring mounting region A; a second insulation layer 32 formed on the first insulation layer 31, having an opening part 32a on the wiring component mounting region A and a connection hole H on the wiring layer P; a wiring board 1 mounted on the wiring component mounting region A in the opening part 32a on the second insulation layer 32 and a wiring component 40 having one connection part C and an other connection part C; a first electronic component 60 connected to one connection part C of the wiring component 40 and connected to the wiring layer P in the other connection hole H of the wiring board 1; and a second electronic component 70 connected to the other connection part C of the wiring component 40 and connected to the wiring layer P in the other connection hole H of the wiring board 1.SELECTED DRAWING: Figure 11