发明名称 SUBSTRATE PROCESSING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing device in which a brittle material substrate is not easily scratched.SOLUTION: A substrate processing device includes: a belt 11 for transferring a brittle material substrate 300; and a clamp device 40 for clamping the brittle material substrate 300 placed on the belt 11. A support surface 51A of the clamp device 40, which supports the brittle material substrate 300, is formed so as to be flush with an upper surface of the belt 11.SELECTED DRAWING: Figure 1
申请公布号 JP2016094023(A) 申请公布日期 2016.05.26
申请号 JP20160027549 申请日期 2016.02.17
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO LTD 发明人 TOKUNAGA NAO
分类号 B28D7/00;B28D7/04;C03B33/03 主分类号 B28D7/00
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