Micromechanical sensor device and corresponding manufacturing method

摘要

A micromechanical sensor device, and a corresponding method, including an ASIC substrate having first front and rear sides, a first rewiring element on the first front side; a MEMS substrate having a second front side, and a second rear side having a base substrate and a second rewiring element formed thereon; a micromechanical functional layer having at least one movable sensor structure, and which is on the second front side of the second rewiring element; a capping element having third front and rear sides, the third rear side being applied to the second front side for capping the sensor structure; and a recess formed in the base substrate on the second rear side, or in the capping element on the third front side, and within which the ASIC substrate is suspended on a flexible layered first suspension element via the first rewiring element, forming a cavity surrounding the ASIC chip.

主权项

1. A micromechanical sensor device, comprising:
an ASIC substrate having a first front side and a first rear side, a first rewiring element being formed on the first front side; a MEMS substrate having a second front side, and a second rear side having a base substrate and a second rewiring element formed thereon; a micromechanical functional layer in which at least one movable sensor structure is formed, and which is formed on the second front side of the second rewiring element; a capping element having a third front side and a third rear side, wherein the third rear side is applied to the second front side for capping the sensor structure; and a recess formed in the base substrate on the second rear side, or in the capping element on the third front side, and within which the ASIC substrate is suspended on a flexible layered first suspension element via the first rewiring element, forming a cavity which surrounds the ASIC chip.