PROCESS FOR PRODUCING WIRING BOARD, AND WIRING BOARD

摘要

Provided are a wiring board and a process for producing the wiring board, the process being capable of easily forming a conductor pattern. The process comprises: a transfer step in which a resin composition comprising a first compound that brings about a low surface free energy and a second compound that brings about a higher surface free energy than the first compound is brought into contact with an original plate bearing a pattern with a desired surface free energy difference and is cured to obtain a base to which the surface free energy difference pattern of the original plate has been transferred; and a conductor pattern formation step in which an electroconductive coating composition is applied to the base surface to which the pattern has been transferred, thereby forming a conductor pattern.