| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor chip peeling device of which a mechanism and an operation are simplified.SOLUTION: A semiconductor chip peeling device 1 that peels a semiconductor chip T1 from a semiconductor chip adhesive sheet T to which the semiconductor chip T1 is adhered, and adsorbs to an adsorption collet 4, comprises: a holding mechanism 2 that holds the semiconductor chip adhesive sheet T; a contacting member 13 that has a contacting surface 20 contacting with a surface opposite to the surface of the side to which the semiconductor chip T1 of semiconductor chip adhesive sheet T held by the holding mechanism 2 is adhered; a projection member 14 that projects to the side of semiconductor chip adhesive sheet T near than that of contacting surface 20, and has a contacting part 24 contacting with the semiconductor chip adhesive sheet T; and a moving mechanism 7 that allows the projection member 14 to move so that the contacting part 24 moves toward the semiconductor chip T1 from an external side of the semiconductor chip T1.SELECTED DRAWING: Figure 1 |
