| 发明名称 |
BENDING A CIRCUIT-BEARING DIE |
| 摘要 |
An image sensor device includes a substrate, a die, and an adhesive layer positioned between the substrate and the die. The substrate includes a first side having a curved surface. The die includes an image sensor component attached to the curved surface of the substrate. At least a portion of the die comprising the image sensor component has a curved surface. The adhesive layer positioned between the curved surface of the substrate and the die provides a fixed attachment between the die and the substrate. |
| 申请公布号 |
US2016150131(A1) |
申请公布日期 |
2016.05.26 |
| 申请号 |
US201414550590 |
申请日期 |
2014.11.21 |
| 申请人 |
Apple Inc. |
发明人 |
Toc Howell John Chua;Venkatesappa Prakash;Yang Annabelle Q.;Cabonegro Melvin C. |
| 分类号 |
H04N5/225;B29C65/00 |
主分类号 |
H04N5/225 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A camera, the camera comprising:
one or more lenses for directing light to an image sensor component of the camera; and an image sensor device, wherein
the image sensor device comprises
a substrate, wherein the substrate comprises:
a first side having a curved surface;a die comprising an image sensor component attached to the curved surface of the substrate, wherein
at least a portion of the die comprising the image sensor component has a curved surface. |
| 地址 |
Cupertino CA US |
