INTEGRATED DEVICE PACKAGE COMPRISING HETEROGENEOUS SOLDER JOINT STRUCTURE

摘要

Some features pertain to an integrated circuit device that includes a first package substrate, a first die coupled to the first package substrate, a second package substrate, and a solder joint structure coupled to the first package substrate and the second package substrate. The solder joint structure includes a solder comprising a first melting point temperature, and a conductive material comprising a second melting point temperature that is less than the first melting point temperature. In some implementations, the conductive material is one of at least a homogeneous material and/or a heterogeneous material. In some implementations, the conductive material includes a first electrically conductive material and a second material. The conductive material is an electrically conductive material.

主权项

1. An integrated circuit device comprising:
a first package substrate; a first die coupled to the first package substrate; a second package substrate; and a solder joint structure coupled to the first package substrate and the second package substrate, the solder joint structure comprising:
a solder comprising a first melting point temperature; anda conductive material comprising a second melting point temperature that is less than the first melting point temperature.