| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device capable of enhancing heat dissipation.SOLUTION: An electronic device 100 includes a wiring board 10, a power semiconductor element 21 mounted on one side of the wiring board 10, a first heat sink 41 mounted on the opposite side of the wiring board 10, and a mold resin 70 provided on the opposite side and sealing the first heat sink 41, and the connection of the wiring board 10 and first heat sink 41. The wiring board 10 is provided from one side over the opposite side, and through wiring 12 connected electrically with a power semiconductor element 21 is arranged oppositely thereto. The first heat sink 41 is arranged oppositely to the through wiring 12, and forms a part of a current path connected electrically with the through wiring 12 and passing through the power semiconductor element 21.SELECTED DRAWING: Figure 3 |
