| 摘要 |
PROBLEM TO BE SOLVED: To provide an etching device where, first, even if the spray pressure of an etchant is increased, variation is not generated in the circuit pattern to be formed, and etching precision is improved, and, secondly, this can be easily realized without troubles.SOLUTION: Provided is an etching device 6, e.g., used for the production process of an electronic circuit board, jetting an etchant A to the substrate material B horizontally carried by a conveyer 4, and performing etching treatment. Then, the device has a dam roll 3 and a liquid stop body 12. The dam roll 3 stops the phenomenon that the etchant A flows to the carrying direction E to and flow of the upper face of the board material B, and regulates the same to flow right and left. The liquid stop body 12 regulates the etchant A to be scattered or overflowed over the dam roll 3, thus regulating frontward and downward flowage. The dam roll 3 and the liquid stop body 12 are provided on the upper side of the board material A to be carried, and the liquid stop body 12 is provided on the dam roll 3.SELECTED DRAWING: Figure 1 |
