ELECTRONIC APPARATUS

摘要

An electronic apparatus includes a board, an electronic component, a mold resin a rod-like connection terminal and a case. The board includes: a first surface; a second surface, which is opposite to the first surface; a wire pattern; and a through-hole having a metal member connected to the wire pattern. The electronic component mounted on the first surface of the board. The mold resin seals the electronic component on the first surface of the board. The rod-like connection terminal inserted into the through-hole from a distal end of the through-hole and electrically connected to the metal member. The case having a surface on which the connection terminal stands and accommodating the board on which the electronic component is mounted. The board is arranged such that the first surface on which the electronic component and the mold resin are arranged faces the surface of the case on which the connection terminal stands.

主权项

1. An electronic apparatus comprising:
a board having:
a first surface,a second surface opposite to the first surface,a wiring pattern formed on the board, anda through-hole formed in the board and having a metal member connected to the wiring pattern; an electronic component mounted on the first surface of the board; a mold resin sealing the electronic component on the first surface of the board; a rod-like connection terminal inserted into the through-hole from a distal end of the rod-like connection terminal and electrically connected to the metal member in the through-hole; and a case having a surface on which the rod-like connection terminal stands and accommodating the board on which the electronic component is mounted, wherein: the board is arranged such that the first surface on which the electronic component and the mold resin are arranged faces the surface of the case on which the rod-like connection terminal stands, and a heat dissipating path is arranged at the second surface opposite to the first surface of the board on which the electronic component and the mold resin are arranged; and the metal member and the rod-like connection terminal are connected at an outer side of the electronic component and the mold resin as well as an outer side of the heat dissipating path.