| 发明名称 |
INTEGRATED PASSIVE MODULE, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF |
| 摘要 |
An integrated passive module comprises a ceramic substrate, a planar layer and a thin film laminate. At least one first passive component is embedded in ceramic substrate. The planar layer is disposed on the ceramic substrate. The thin film laminate comprises at least one second passive component and disposed on the planar layer. The thin film laminate is electrically connected to the first passive component. This disclosure also discloses a semiconductor device comprising an integrated passive module and at least one active component. The at least one active component is electrically connected to the first passive component and the second passive component. |
| 申请公布号 |
US2016150649(A1) |
申请公布日期 |
2016.05.26 |
| 申请号 |
US201514952571 |
申请日期 |
2015.11.25 |
| 申请人 |
PENG Hsien-Ping |
发明人 |
PENG Hsien-Ping |
| 分类号 |
H05K1/18;H05K3/30;H05K3/46;H01L23/00;H05K1/03 |
主分类号 |
H05K1/18 |
| 代理机构 |
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代理人 |
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| 主权项 |
1. An integrated passive module, comprising:
a ceramic substrate in which at least one first passive component is embedded; a planar layer disposed on the ceramic substrate; and a thin film laminate comprising at least one second passive component and disposed on the planar layer, wherein the thin film laminate is electrically connected to the first passive component. |
| 地址 |
Tainan City TW |
