发明名称 SUBSTRATE CARRIER USING A PROPORTIONAL THERMAL FLUID DELIVERY SYSTEM
摘要 A substrate carrier is described that uses a proportional thermal fluid delivery system In one example the apparatus includes a heat exchanger to provide a thermal fluid to a fluid channel of a substrate carrier and to receive the thermal fluid from the fluid channel, the thermal fluid in the fluid channel to control the temperature of the carrier during substrate processing. A proportional valve controls the rate of flow of thermal fluid from the heat exchanger to the fluid channel, A temperature controller receives a measured temperature from a thermal sensor of the carrier and controls the proportional valve in response to the measured temperature to adjust the rate of flow.
申请公布号 US2016148822(A1) 申请公布日期 2016.05.26
申请号 US201414555467 申请日期 2014.11.26
申请人 Criminale Phillip;Phi Justin;Marohl Dan A.;Shoji Sergio Fukuda;Mays Brad L. 发明人 Criminale Phillip;Phi Justin;Marohl Dan A.;Shoji Sergio Fukuda;Mays Brad L.
分类号 H01L21/67;H01L21/66;H01L21/683;H01J37/32;H01L21/3065 主分类号 H01L21/67
代理机构 代理人
主权项 1. An apparatus comprising: a heat exchanger to provide a thermal fluid to a fluid channel of a substrate carrier and to receive the thermal fluid from the fluid channel, the thermal fluid in the fluid channel to control the temperature of the carrier during substrate processing; a proportional valve to control the rate of flow of thermal fluid from the heat exchanger to the fluid channel; and a temperature controller to receive a measured temperature from a thermal sensor of the carrier and to control the proportional valve in response to the measured temperature to adjust the rate of flow.
地址 Livermore CA US