INKJET PHOTO- AND HEAT-CURABLE ADHESIVE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND ELECTRONIC PART

摘要

Provided is an inkjet photo- and heat-curable adhesive capable of increasing the thickness precision of an adhesive layer in which the adhesive is cured and also capable of making it more difficult for voids to occur in the adhesive layer. This inkjet photo- and heat-curable adhesive comprises a photocurable compound, a heat-curable compound, a photopolymerization initiator and a heat-curing agent. When light of 1000 mJ/cm2 cumulative light quantity is irradiated on the adhesive so that the irradiance at 365 nm is 100 mW/cm2 and a B-staged adhesive is obtained, the elastic modulus at 25°C of the B-staged adhesive is 5.0 × 102 Pa to 8.0 × 104 Pa.