| 摘要 |
An embodiment relates to a wafer loading apparatus of wafer polishing equipment. Provided is the wafer loading apparatus of wafer polishing equipment, comprising: a wafer polishing unit that includes a polishing carrier having a wafer hole formed therein in which a wafer is loaded, wherein both sides of the wafer are polished by upper and lower surface plates; a wafer transfer unit that includes a transfer arm disposed above the polishing carrier to transfer the wafer, wherein a transfer plate corresponding to the shape of the wafer is connected to one end the transfer arm; a wafer position detecting unit mounted on the bottom of the transfer plate to detect the position of the wafer hole; a plurality of wafer attachment/detachment units formed on the edge portion of the transfer plate; a wafer alignment unit mounted on the top of the transfer plate to align the wafer; and a controller to which data on the position of the wafer hole, which is detected by the wafer position detecting unit, is transmitted and which calculates the position where the wafer is to be loaded by the wafer attachment/detachment unit and the wafer alignment unit. |
