LIGHT EMITTING DEVICE

摘要

Disclosed is a light emitting device, comprising: a substrate; a light emitting unit placed on the substrate and configured to include a light emitting element and a wavelength conversion unit which is placed on the light emitting element; a bonding layer placed between the light emitting unit and the substrate and configured to bond the light emitting unit to the substrate; and a sidewall unit encompassing and coming into contact with a side surface of the light emitting unit. The bonding layer includes a metal sintered body, which comprises a metal particle. The purpose of the present invention is to provide the light emitting device with high heat dissipation efficiency and reliability.