| 摘要 |
An LED module group, comprising: a substrate (1) and at least two SMD LEDs (21) disposed on the substrate (1), chip groups (2) composed of several SMD LEDs (21) disposed at different locations on the substrate (1), and a thermal insulation layer (3) arranged with respect to part of or all of the chip groups (2) is disposed between the substrate (1) and the SMD LEDs (21). The chip groups (2) are each at different locations on the substrate (1), and heat is conducted via the thermal insulation layer (3) between the chip groups (2) such that the temperature on the substrate (1) is balanced, thus ensuring an improved service life of the LED module group. |
