发明名称 ウエハ処理装置
摘要 <P>PROBLEM TO BE SOLVED: To prevent undesirable gases in a wafer container from flowing into a wafer processing apparatus, when purging the internal space of the wafer container. <P>SOLUTION: An opener provided at the load port of the wafer processing apparatus has a drive system for driving a door and a chamber, and a purge mechanism for purging the internal space of the wafer container. Three actuators of the drive system are provided on the outside of the chamber. The supply port of the purge mechanism is provided at a position higher than the wafer container, and the exhaust port is provided at a position lower than the wafer container. During the purging, the internal space of the wafer container and the internal space of the chamber are connected to form one enclosed purge space. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP5925474(B2) 申请公布日期 2016.05.25
申请号 JP20110266466 申请日期 2011.12.06
申请人 株式会社日立ハイテクマニファクチャ&サービス 发明人 大野 和之;平山 文彦
分类号 H01L21/677 主分类号 H01L21/677
代理机构 代理人
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