| 摘要 |
PROBLEM TO BE SOLVED: To relax a stress applied to a connection member.SOLUTION: A semiconductor device comprises: a semiconductor element 11; and a connection member 30 which includes a plating layer for electrically and mechanically connecting the semiconductor element and a substrate 21 and connecting a plurality of metal particles and the above-described plurality of metal particles, and which includes a porous structure where metals 32 are mixed with cavities 34. A semiconductor device manufacturing method comprises: forming a mask layer on a semiconductor element 11; arranging a plurality of metal particles 32a in an opening of the mask layer; electrically and mechanically connecting the semiconductor element and a substrate 21 by connecting the plurality of metal particles 32a with each other by plating to form a connection member 30 including a porous structure where metals 32 are mixed with cavities 34. |
