| 摘要 |
The purpose of the present invention is to provide a copper foil with a carrier foil suitable for manufacturing a copper clad laminate for use in laser perforation processing. In order to achieve this purpose, provided is a copper foil with a carrier foil which is equipped with a carrier foil/release layer/bulk copper layer layered configuration and which is characterized in that: a roughening-treated layer having a fine uneven structure is provided on both sides of the copper foil with a carrier foil, such structure being formed by needle-shaped or plate-shaped protruded sections which comprise a copper conjugated compound and the maximum length of which is 500 nm or less; the roughening-treated layer provided on the surface of the carrier foil is used as a laser-light-absorbing layer; and the roughening-treated layer provided on the surface of the bulk copper layer is used as an adhesion layer with an insulation layer component. |
