| 摘要 |
A solder joint manufactured of an alloy essentially composed of 0.01-7.6 wt% Cu, 0.001-6 wt% Ni, and the remaining of Sn. Each of Cu and Ni has a maximum concentration range. The lower limit of the range of Ni is 0.01 wt% and preferably 0.03 wt%. The upper limit of the range of Ni is 0.3 wt% and preferably 0.1 wt%. The lower limit of the range of Cu is 0.1 wt% and preferably 0.2 wt%. The upper limit of the range of Cu is 7 wt% and preferably 0.92 wt%. The invention includes the solder joint essentially having these compositions. |
