| 摘要 |
PROBLEM TO BE SOLVED: To provide a perforated metallic foil in which through holes with a seamless and fine pattern are formed without generation of burrs and loss of metal during producing processes, and also to provide a method for producing the perforated metallic foil.SOLUTION: A perforated metallic foil with a carrier includes: a carrier including a patterned electroless copper plating layer formed on one face of a support and a peeling layer formed on the patterned electroless copper plating layer; and a perforated metallic foil formed only on the peeling layer of the carrier by being subjected to electrolytic metal plating treatment. |
