| 摘要 |
The present invention relates to a retainer ring which fixes the position of a semiconductor wafer in a chemical mechanical polishing process and a method for manufacturing the same. The present invention provides a retainer ring of a new material combination method and a manufacturing method. Price competitiveness is gained by using the retainer ring formed by the combination of a metallic material and a resin material, and increases the bonding force between the metallic material and the resin material by using an insert injection mold method. Meanwhile, especially, more enhanced cohesion between heterogeneous materials can be secured by applying a hole filled with resin and a groove structure in the inner ring of a metallic material. So, durability and functionality can be improved. |
