| 摘要 |
PROBLEM TO BE SOLVED: To provide a marking which is applicable to an electronic component placed under a severe environment.SOLUTION: A method of manufacturing an electronic component is provided, which includes an applying step (steps S4, S9) of applying ink 45 having light-curing property and containing ≥5 mass% and ≤20 mass% N-vinyl caprolactam onto a semiconductor chip 12 being the electronic component to perform marking, a curing step (S3 to S6, S8 to S11) of irradiating the applied ink 45 with light to cure the ink to attain a curing ratio of ≥95%, and a heating step (step S15) of heating the ink 45 at ≥150°C and ≤200°C after the irradiation step. |
