| 摘要 |
PROBLEM TO BE SOLVED: To provide a film-like adhesive capable of improving connection reliability in connection between a semiconductor element and a support member.SOLUTION: A film-like adhesive 1 includes: a thermosetting component containing (a1) at least either of an epoxy resin having a softening point of ≥85°C and an epoxy equivalent of ≥500 and a phenol resin having a softening point of ≥85°C and a hydroxyl equivalent of ≥500, (a2) at least either of an epoxy resin having a softening point of ≥85°C and an epoxy equivalent of ≤150 and a phenol resin having a softening point of ≥85°C and a hydroxyl equivalent of ≤150, and (a3) at least either of an epoxy resin having a softening point of ≤75°C and a phenol resin; (b) a prescribed high molecular weight component; and (c) an inorganic filler; wherein each content of the (a1) component, the (a2) component, the (a3) component, the high molecular weight component and the inorganic filler is within each prescribed range. |
