| 摘要 |
PROBLEM TO BE SOLVED: To prevent supply of exposure light to photosensitive material from a side face of a semiconductor substrate when a predetermined pattern is formed by an exposure development process to the photosensitive material formed on a main face of the semiconductor substrate.SOLUTION: A method of manufacturing a semiconductor device includes the steps of: preparing a wafer 5 in which a conductive layer 2 and a negative resist 3 are formed in order on a surface of a wafer 1; applying a light shielding member 32 across a surface and a side face of the negative resist 3, at least at a part of an outer edge of the wafer 5; performing exposure on the negative resist 3; removing the light shielding member 32, and developing the negative resist 3. |
