| 摘要 |
This invention provides an electronic device and a method for manufacturing an electronic device whereby even if a conductive pattern is formed using a conductive-polymer inactivation technique, resistance values between paths within frame wiring can be set appropriately without requiring an extra process. Said method includes the following steps: a film formation step in which a uniform conductive-polymer film is formed on a substrate; an inactivation step in which a prescribed region of said conductive-polymer film is inactivated so as to form an insulating section and a plurality of electrode sections; an insulation-layer formation step in which, in a single process and using a single material, a jumper insulation layer is formed on the conductive-polymer film in a jumper-wiring formation region of the substrate and a frame-wiring insulation layer is formed on the conductive-polymer film in a frame-wiring formation region of the substrate; a jumper-wiring formation step in which jumper wiring comprising conductor paths is formed on the jumper insulation layer; and a frame-wiring formation step in which frame wiring comprising conductor paths is formed on the frame-wiring insulation layer. |
