| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem of having to extracting both ends of a coil to a bottom face of a laminate through a through via hole because of the complication of a structure in the laminate in the case of forming terminals only on the bottom face of the laminate because, in electronic equipment with an electronic component mounted thereon, a reduction in a mounting area of a wiring board of the electronic equipment is desired in accordance with high functionalization and such a structure in which a solder fillet is not formed on a side face of the electronic equipment is desired when the electronic component is mounted on the wiring board. <P>SOLUTION: An insulator layer and a conductor pattern are laminated, and a circuit element is formed in the laminate. Both ends of the circuit element are extracted to side faces of the laminate. Terminals are formed over the bottom face and side faces of the laminate. The terminals formed on the side faces of the laminate are covered with an insulator. <P>COPYRIGHT: (C)2013,JPO&INPIT |
