发明名称 電子部品実装装置
摘要 The present invention provides an electronic component mounting apparatus, which can improve the production efficiency of substrates. The electronic component mounting apparatus comprises an electronic component supply device which supplies electronic components to a holding area; a holder main body which has a suction nozzle for holding the electronic components supplied to the holding area by the electronic component supply device, a suction nozzle drive unit for performing up-down driving and rotary driving on the suction nozzle and providing air pressure to drive the suction nozzle, and a holder support for supporting the suction nozzle and the suction nozzle drive unit; a holder moving mechanism for moving the holder main body; a display part for displaying images; and a control device for controlling the operation of all the components. The control device detects movement records of the holder moving mechanism moving the holder main body, and if the movement records exceed a preset threshold, a warning image for the maintenance of the holder moving mechanism is displayed on the display part.
申请公布号 JP5925540(B2) 申请公布日期 2016.05.25
申请号 JP20120061211 申请日期 2012.03.16
申请人 JUKI株式会社 发明人 佐藤 徳朋;野尻 信明
分类号 H05K13/04 主分类号 H05K13/04
代理机构 代理人
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