发明名称 |
SEMICONDUCTOR MODULE |
摘要 |
To provide a semiconductor module that has high reliability of electric connection by a solder and is inexpensive. A joint surface of an electrode-jointing portion (36bb) that is opposed to a surface to be jointed of a gate electrodes (G) of a bare-chip FET (35) and a joint surface of a substrate-jointing portion (36bc) that is opposed to a surface to be jointed of another wiring pattern (33c) include an outgas releasing mechanism that makes outgas generated from a molten solder during solder jointing of a metal plate connector. (3Gb) be released from solders (34c and 34f) interposed between the joint surfaces and the surfaces to be jointed. |
申请公布号 |
EP3024024(A1) |
申请公布日期 |
2016.05.25 |
申请号 |
EP20140855368 |
申请日期 |
2014.10.06 |
申请人 |
NSK LTD. |
发明人 |
SUNAGA, TAKASHI;KANEKO, NOBORU;MIYOSHI, OSAMU;SUZUKI, RYOICHI |
分类号 |
H01L23/492;H01L21/60;H01L25/07;H01L25/18 |
主分类号 |
H01L23/492 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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