| 摘要 |
PROBLEM TO BE SOLVED: To achieve efficient and highly accurate mounting of a lead type electronic component.SOLUTION: An electronic component mounting device includes: an electronic component supplying unit for supplying a lead type electronic component, which has an electronic component body and a lead connected to the body, to a holding position; a head body having suction or grip nozzles each of which holds the electronic component body supplied from the electronic component supplying unit, nozzle drive parts each of which is driven vertically and rotationally with the nozzle attached thereto and supplies air pressure, and a head support; a control unit for controlling a movement of the head body and the electronic component supplying unit; and a state detection unit for detecting a state of the lead type electronic component held by the nozzle. If it is determined, on the basis of the state detected by the state detection unit regarding the state of the lead type electronic component held by the nozzle, that the state of the lead of the electronic component satisfies a condition, the control unit inserts the electronic component into a substrate. |
