| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which realizes high heat radiation, is inexpensive and achieves high reliability and good productivity, and to provide a manufacturing method of the semiconductor device.SOLUTION: A semiconductor device 10 includes: a first cooler 8 in which a refrigerant is circulated; a heat radiation plate 2 that is disposed facing the first cooler 8 so as to be spaced away from the first cooler 8; a semiconductor element 1 joined to the heat radiation plate 2; a thermoplastic mold resin 6 which encloses the heat radiation plate 2 and the semiconductor element 1 and contacts with the first cooler 8; and a second cooler 8 in which the refrigerant circulates and contacting with the mold resin 6. The heat radiation plate 2 is formed by a clad material. |
