SEALANT LAMINATED COMPOSITE, SEALED SEMICONDUCTOR DEVICES MOUNTING SUBSTRATE, SEALED SEMICONDUCTOR DEVICES FORMING WAFER, SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS

摘要

It is an object of the invention to provide a sealant laminated composite that is very high in versatility, even when a large diameter or thin substrate or wafer is sealed, can prevent the substrate or wafer from warping and the semiconductor devices from peeling, can collectively seal a semiconductor devices mounting surface of a substrate on which semiconductor devices are mounted or a semiconductor devices forming surface of a wafer on which semiconductor devices are formed on a wafer level, and can provide a sealant laminated composite that is excellent in the heat resistance and humidity resistance after sealing. A sealant laminated composite for collectively sealing a semiconductor devices mounting surface of a substrate on which semiconductor devices are mounted or a semiconductor devices forming surface of a wafer on which semiconductor devices are formed includes: a support wafer; and an uncured resin layer constituted of an uncured thermosetting resin formed on one side of the support wafer.