发明名称 半導体装置
摘要 An embodiment is a semiconductor device which includes a first oxide semiconductor layer over a substrate having an insulating surface and including a crystalline region formed by growth from a surface of the first oxide semiconductor layer toward an inside; a second oxide semiconductor layer over the first oxide semiconductor layer; a source electrode layer and a drain electrode layer which are in contact with the second oxide semiconductor layer; a gate insulating layer covering the second oxide semiconductor layer, the source electrode layer, and the drain electrode layer; and a gate electrode layer over the gate insulating layer and in a region overlapping with the second oxide semiconductor layer. The second oxide semiconductor layer is a layer including a crystal formed by growth from the crystalline region.
申请公布号 JP5926781(B2) 申请公布日期 2016.05.25
申请号 JP20140178666 申请日期 2014.09.03
申请人 株式会社半導体エネルギー研究所 发明人 山崎 舜平
分类号 H01L29/786;H01L21/28 主分类号 H01L29/786
代理机构 代理人
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