发明名称 Laserbauelementeverbund und Verfahren zum Herstellen eines Laserbauelements
摘要 A laser component assembly includes a carrier including first and second component portions wherein each component portion has a chip mounting surface, a lens mounting surface and a stop surface, the stop surface of each component portion includes first and second stop partial surfaces, the first stop partial surface is formed on a first stop element and the second stop partial surface is formed on a second stop element, the chip mounting surface is arranged between the first stop element and the second stop element, the stop surface is oriented perpendicularly to the chip mounting surface, a laser chip arranged on the chip mounting surface, the laser component assembly as a lens bar comprising an optical lens component portion and the lens bar is arranged on the lens mounting surfaces of the component portions and bears against the stop surfaces of the component portions.
申请公布号 DE112014003859(A5) 申请公布日期 2016.05.25
申请号 DE20141103859T 申请日期 2014.08.14
申请人 OSRAM Opto Semiconductors GmbH 发明人 Eckert, Tilman
分类号 H01S5/022;G02B7/02;G02B27/09;H01S5/40 主分类号 H01S5/022
代理机构 代理人
主权项
地址