| 摘要 |
The present invention relates to a semiconductor package including: a housing having an internal space; a power unit installed in the housing; and a control unit installed in the housing so as to be electrically connected to the power unit. The housing has a plurality of elastic protrusions connected to a metal pattern layer of the control unit, and the power unit is electrically connected to the control unit by at least one of the elastic protrusions. Therefore, a wire bonding process can be eliminated. |
