| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a structure which efficiently radiates heat generated from a semiconductor chip from the front surface side of the semiconductor chip without affecting the design of a circuit and wiring included in the semiconductor chip. <P>SOLUTION: A semiconductor device 2 includes: a semiconductor chip 2 including a wiring layer 8 which includes an insulator film 5, wiring 6, and multiple first electrodes 7 provided over an entire surface of the insulator film 5; and a high heat transmission member 15 adhered to a region where the first electrodes 7 are not provided on the surface of the insulator film 5 and having heat conductivity higher than that of the insulator film 5. <P>COPYRIGHT: (C)2013,JPO&INPIT |
