PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC COMPONENT MODULE

摘要

A printed circuit board, a manufacturing method thereof, and an electronic component module are disclosed. The printed circuit board comprises: a first circuit layer; a first insulating layer formed to cover a portion or all of the first circuit layer; a second circuit layer formed on the first insulating layer; a second insulating layer; and a third circuit layer formed on the second insulating layer. Therefore, the printed circuit board can improve reliability of a connection structure between electronic components.