发明名称 Moulding material on the basis of a partially aromatic copolyamide
摘要 A moulding composition, comprising at least 40 wt. % of the following components: a) 60 to 99 parts by wt. of a partially aromatic copolyamide which comprises as polymerized monomer units: I. 30 to 90 mol % of a combination of hexamethylenediamine and terephthalic acid; and II. 70 to 10 mol % of a lactam and/or of an ω-aminocarboxylic acid with 11 or 12 C atoms; and b) 40 to 1 parts by wt. of an olefinic copolymer comprising as polymerized monomer units: i) 35 to 94.9 wt. % of ethene-based monomer units, ii) 5 to 65 wt. % of monomer units based on a 1-alkene with 4 to 8 C atoms, iii) 0 to 10 wt. % of monomer units based on an olefin different from i) and ii), and iv) 0.1 to 2.5 wt. % of monomer units based on an aliphatically unsaturated dicarboxylic acid anhydride, wherein a sum of the weight % values of i), ii), iii) and iv) is 100%, and the sum of the parts by wt. of a) and b) is 100; which can is processed into moulded articles with improved thermal aging resistance is provided.
申请公布号 EP2860220(B1) 申请公布日期 2016.05.25
申请号 EP20140185392 申请日期 2014.09.18
申请人 EVONIK DEGUSSA GMBH 发明人 NITSCHE, JASMIN;HÄGER, HARALD;GEERKENS, SEBASTIAN;BAUMANN, FRANZ-ERICH;BEUTH, REINHARD
分类号 C08L77/02 主分类号 C08L77/02
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