METHOD AND DEVICE OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method and device of manufacturing a semiconductor device capable of securing a gap between an optical component and a substrate such as a semiconductor element with high accuracy in a process of adhering a packaging member such as the optical component, and further of determining adhesive failures and preventing outflow of an adhesive defective item to a post-process.SOLUTION: A vertical distance between a packaging member and a substrate 12 is measured by transmitting and emitting detection light 6 through the packaging member 11 and a junction material 13. While making them approach each other to a predetermined distance, the detection light is emitted to the packaging member in the vertical direction and in the vicinity of at least one corner part of the packaging member in a lateral direction. The quality of an adhesion state is inspected by a waveform of its reflection light.SELECTED DRAWING: Figure 1A