SEMICONDUCTOR DEVICE

摘要

This semiconductor device is formed by stacking a plurality of semiconductor chips that each have a plurality of bump electrodes, each of the plurality of semiconductor chips being provided with an identification section formed on a respective side face. Each semiconductor chip has a similar arrangement for its respective plurality of bump electrodes, and each identification section is formed so that the positional relationship with a respective reference bump electrode provided at a specific location among the respective plurality of bump electrodes is the same in each semiconductor chip. The plurality of semiconductor chips are stacked such that the bump electrodes provided thereon are electrically connected in the order of stacking of the semiconductor chips, while the side faces on which the identification sections are formed are oriented in the same direction.

主权项

1. A semiconductor device comprising:
a plurality of semiconductor chips each having a plurality of bump electrodes that are stacked, wherein:
the plurality of semiconductor chips comprise an identification section formed on the side surfaces thereof;the plurality of bump electrodes are arranged in the same way on the semiconductor chips, and the identification sections are formed in such a way as to have the same positional relationship with a reference bump electrode, from among the plurality of bump electrodes, which is provided at a specific location; andthe plurality of semiconductor chips are stacked in such a way that the bump electrodes provided thereon are electrically connected in the stacking order of the semiconductor chips and in such a way that the side surfaces on which the identification sections are formed are oriented in the same direction.