STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH IMPROVED THERMAL PERFORMANCE AND ASSOCIATED SYSTEMS AND METHODS

摘要

Stacked semiconductor die assemblies with improved thermal performance and associated systems and methods are disclosed herein. In one embodiment, a semiconductor die assembly can include a stack of semiconductor dies and a thermally conductive casing at least partially enclosing the stack of semiconductor dies within an enclosure. A package substrate carries the thermally conductive casing, and an interposer is disposed between the thermally conductive casing and the stack of semiconductor dies. A peripheral portion of the interposer extends laterally beyond the stack of semiconductor dies and is coupled to a plurality of conductive members interposed between the peripheral portion and the package substrate.

主权项

1. A semiconductor die assembly, comprising:
a thermally conductive casing; a package substrate, wherein the package substrate and the thermally conductive casing together define an enclosure; an interposer attached to the thermally conductive casing within the enclosure; and a stack of semiconductor dies disposed between the interposer and the package substrate within the enclosure.