发明名称 PRINTED CIRCUIT BOARD ASSEMBLY WITH IMAGE SENSOR MOUNTED THEREON
摘要 A printed circuit board assembly (PCBA) and a method to assemble the PCBA are disclosed. The PCBA includes a printed circuit board (PCB), an image sensing chip and a protection layer. The PCB includes a first insulation layer, a second insulation layer, a first electrically conductive layer, a second electrically conductive layer, and a third electrically conductive layer. The image sensing chip has a number of bonding pads with a sensor portion facing down through the second opening. The PCBA can function as an image sensing module and make the module have the thinnest thickness.
申请公布号 US2016141235(A1) 申请公布日期 2016.05.19
申请号 US201414543936 申请日期 2014.11.18
申请人 SunASIC Technologies, Inc. 发明人 LIN Chi-Chou;HE Zheng-Ping
分类号 H01L23/498;H05K3/30;H05K3/46;H05K1/18 主分类号 H01L23/498
代理机构 代理人
主权项 1. A printed circuit board assembly (PCBA), comprising: a printed circuit board (PCB), comprising: a first insulation layer having a first opening formed therein;a second insulation layer having a second opening formed therein;a first electrically conductive layer, formed a specific circuit on partial of a top surface of the first insulation layer;a second electrically conductive layer, formed another specific circuit and a plurality of connectors between the first insulation layer and the second insulation layer; anda third electrically conductive layer, formed still another specific circuit on partial of a bottom surface of the second insulation layer,wherein the second opening is smaller than the first opening and formed beneath the first opening; a platform is formed on a top surface of the second insulation layer enclosed by peripherals of the first opening; the plurality of connectors are formed on the platform; and an image sensing chip, having a plurality of bonding pads with a sensor portion facing down through the second opening, and fixed on the platform with each bonding pad connected to one corresponding connector.
地址 New Taipei City TW