| 摘要 |
PROBLEM TO BE SOLVED: To provide a dry film including a resin layer in which bubbles are not easily generated when laminating the resin film on a base material and which has excellent adhesion, and to provide a printed wiring board including a hardened material obtained by hardening the dry film.SOLUTION: A dry film includes a first film, a second film and a resin layer held between the first film and the second film. In the dry film, arithmetic average surface roughness Ra of a surface of the second film, coming into contact with the resin layer, is 0.1 to 1.2 μm, and a surface of the second film, coming into contact with the resin layer, is a surface laminated on the base material.SELECTED DRAWING: Figure 1 |
