发明名称 HEAT CONDUCTIVE RESIN COMPOSITION AND MOLDED BODY CONTAINING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a heat conductive resin composition excellent in mechanical properties and impact resistance.SOLUTION: There is provided a heat conducive resin composition containing a polyphenylene sulfide resin (A), a heat conductive filler (B) and an aramid fiber (C), mass ratio of the polyphenylene sulfide resin (A) and the heat conductive filler (B) (A/B) is 15/85 to 80/20, the content of the aramid fiber (C) is 3 to 30 pts.mass based on total 100 pts.mass of the polyphenylene sulfide resin (A) and the heat conductive filler (B).SELECTED DRAWING: None
申请公布号 JP2016084441(A) 申请公布日期 2016.05.19
申请号 JP20140219369 申请日期 2014.10.28
申请人 UNITIKA LTD 发明人 KAIBARA SUSUMU;FURUKAWA MIKIO;ITO AKIRA
分类号 C08L81/02;C08K3/04;C08K3/34;C08K3/38;C08L77/10 主分类号 C08L81/02
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