发明名称 ELECTRONIC COMPONENT MOUNTING SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide an electronic component mounting system that can easily find a cause for a defect of a mounting board on which an electronic component is mounted.SOLUTION: An electronic component mounting system has an electronic component mounting device having a mounting head which has a suction nozzle freely-movable upwards and downwards relatively to a board and mounts an electronic component on the board by downwards moving the suction nozzle holding the electronic component, a mounting history data creating unit for mounting history data in which unit mounting histories 60 are time-sequentially arranged, each of the unit mounting histories associating a mounting point R(R1, R2, R3, etc.) at which the electronic component is mounted on the board with operation information of the mounting head when the electronic component is mounted at the mounting point R, and a storage unit for storing the mounting history data in association with the board as a mounting target. The operation information of the mount head contains information on the downward movement height position of the suction nozzle when the suction nozzle is downwards moved to mount the electronic component on the board.SELECTED DRAWING: Figure 10
申请公布号 JP2016086084(A) 申请公布日期 2016.05.19
申请号 JP20140217966 申请日期 2014.10.27
申请人 PANASONIC IP MANAGEMENT CORP 发明人 MAENISHI YASUHIRO;YASOJIMA TSUTOMU
分类号 H05K13/04;H05K13/08 主分类号 H05K13/04
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