| 摘要 |
A package (100) comprising a support structure (102) comprising an electrically insulating material, a microelectromechanical system (MEMS) component, a cover structure (108) comprising an electrically insulating material and mounted on the support structure (102) for at least partially covering the MEMS component (106), and an electronic component (104) embedded in one of the support structure (102) and the cover structure (108), wherein at least one of the support structure (102) and the cover structure (108) comprises an electrically conductive contact structure (110). |
