发明名称 POLYAMIDE-IMIDE RESIN-BASED HEAT-RESISTANT RESIN COMPOSITION, COATING, COATING PLATE AND HEAT RESISTANT PAINT
摘要 PROBLEM TO BE SOLVED: To provide a polyamide-imide resin-based heat-resistant resin composition superior in heat resistance and adhesion after high-temperature curing not less than 350°C, and workability, and to provide a coating, a coating plate and heat resistant paint therewith.SOLUTION: There is provided a polyamide-imide resin-based heat-resistant resin composition containing (A) polyamide-imide resin and (B) p-cresol and butylated dicyclopentadiene as antioxidant. There are also provided a coating formed by applying and heating the polyamide-imide resin-based heat-resistant resin composition, a coating plate having the coating formed by applying and heating the composition on the surface, and paint as a coating component.SELECTED DRAWING: None
申请公布号 JP2016084431(A) 申请公布日期 2016.05.19
申请号 JP20140218863 申请日期 2014.10.28
申请人 HITACHI CHEMICAL CO LTD 发明人 YOTSUYA SEIICHI
分类号 C08L79/08;C08K5/13;C09D7/12;C09D179/08 主分类号 C08L79/08
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